Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT

Peringkat dan informasi jurnal

Akreditasi Sinta

Tidak berlaku (jurnal luar negeri)

Scopus

Terindeks

SJR 2025

0,165

H-index (SCImago)

15

Cakupan Scopus

2011–2024

ISSN

2150-5934, 2150-5942

Penerbit

IEEE Computer Society

Negara

United States

Biaya publikasi (APC)

Belum tercatat. Cek halaman biaya di situs jurnal.

Kategori dan kuartil Scopus

• Control and Systems Engineering–
• Electrical and Electronic Engineering–
• Hardware and Architecture–

Kuartil per kategori dari SCImago Journal Rank 2025. Kuartil terbaik dipakai sebagai peringkat utama.

Cakupan (focus and scope)

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Pertanyaan umum

Apakah Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT terakreditasi Sinta?

Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT tidak terakreditasi Sinta (Sinta hanya mengakreditasi jurnal Indonesia).

Apakah Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT terindeks Scopus?

Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT terindeks Scopus (SCImago 2025).

Berapa biaya publikasi (APC) di Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT?

Biaya publikasi jurnal ini belum tercatat di data kami. Periksa halaman biaya atau pedoman penulis di situs jurnal.