Proceedings of the Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP

Peringkat dan informasi jurnal

Akreditasi Sinta

Tidak berlaku (jurnal luar negeri)

Scopus

Terindeks

H-index (SCImago)

1

Cakupan Scopus

2025–2025

ISSN

2768-1874, 2836-8487

Penerbit

Institute of Electrical and Electronics Engineers Inc.

Negara

United States

Biaya publikasi (APC)

Belum tercatat. Cek halaman biaya di situs jurnal.

Kategori dan kuartil Scopus

• Control and Optimization–
• Electrical and Electronic Engineering–
• Electronic, Optical and Magnetic Materials–
• Instrumentation–
• Safety, Risk, Reliability and Quality–

Kuartil per kategori dari SCImago Journal Rank 2025. Kuartil terbaik dipakai sebagai peringkat utama.

Cakupan (focus and scope)

Cakupan jurnal ini belum tercatat di data kami. Baca bagian Focus and Scope di situs jurnal sebelum mengirim naskah.

Pertanyaan umum

Apakah Proceedings of the Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP terakreditasi Sinta?

Proceedings of the Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP tidak terakreditasi Sinta (Sinta hanya mengakreditasi jurnal Indonesia).

Apakah Proceedings of the Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP terindeks Scopus?

Proceedings of the Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP terindeks Scopus (SCImago 2025).

Berapa biaya publikasi (APC) di Proceedings of the Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP?

Biaya publikasi jurnal ini belum tercatat di data kami. Periksa halaman biaya atau pedoman penulis di situs jurnal.